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Components
9592A Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
DRM-18H Component Identification Training and Reference Guide
J-STD-012 Implementation of Flip Chip & Chip Scale Technology
J-STD-013 Implementation of Ball Grid Array & Other High Density Technology
J-STD-020D-1 IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
J-STD-026 Semiconductor Design Standard for Flip Chip Applications
J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
J-STD-032 Performance Standard for Ball Grid Array Balls
J-STD-033C Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
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ETECH-trainingen
Willemselaan 16
PO Box 1005
6460 BA KERKRADE
The Netherlands
Phone: + 31 (0)45 711 23 90
Mobile: + 31 (0)654 23 09 05
info@etech-trainingen.biz
Chamber of Commerce
: 14129416
VAT: NL 1572.23.255.B.01
Rabobank: 1167.31.974
EORI: NL 157223255