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HDI
2315 Design Guide for High Density Interconnects & Microvias
4104 Specification for High Density Interconnect (HDI) and Microvia Materials
6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
6801 IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards
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ETECH-trainingen
Willemselaan 16
PO Box 1005
6460 BA KERKRADE
The Netherlands
Phone: + 31 (0)45 711 23 90
Mobile: + 31 (0)654 23 09 05
info@etech-trainingen.biz
Chamber of Commerce
: 14129416
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