The trainings will be held in the Netherlands or will be given within your own company! A minimum of 5 participants is necessary for an "in-company" training. The date and time will be set in consultation with the customer. All courses are customized. Customized training stand out from the open training content. Not only because they entirely on your learning needs and requirements, but also because of the close collaboration between you as client and the trainer. A partnership in which we work together to develop the potential of your employees, teams and organization. The success of an organization is determined by the employees. We want to achieve that, with the proper advice, training and coaching, employees will bring out the best of themselves.

01.05.2012
IPC/WHMA-A-620A CIS
Recertification

Price : € 669,- p.p.

07.05.2012
IPC-A-610E CIS

Certification

Price : € 889.- p.p.

24.05.2012
IPC-7711 & 7721 CIS

Recertification

Price : € 779.- p.p.

14.06.2012
IPC-A-610E CIS

Recertification

Price : € 669.- p.p.

18.06.2012
IPC/WHMA-A-620A CIS

Certification

Price : € 889.- p.p.

12.07.2012
IPC-A-600H CIS

Certification

Price : € 889.- p.p.

23.07.2012
IPC-7711 & 7721 CIS

Certification

Price : € 989.- p.p.

09.08.2012
IPC-A-600H CIS

Recertification

Price : € 669.- p.p.

Isola Group S.a.r.l., a leading global material sciences company that designs, develops, manufactures and markets copper-clad laminates and dielectric prepreg materials used to fabricate advanced multi-layer printed circuit boards (PCBs), has shown 5 new products at the IPC APEX EXPO^® Feb. 28–Mar. 1, 2012 in San Diego, CA.

Here are the 5 new products of Isola:

I-Speed™ (http://www.isola-group.com/products/i-speed-2/) is Isola’s next generation, lead-free compatible, low-loss (Df 0.0065), laminate, and part of its UL family of high-speed digital products (IS415, FR408 and FR408HR), making it easier to qualify by fabricators and OEMs. I-Speed offers both thermal and electrical improvements over competitive products. It has a Tg of 180 degrees Celsius by differential scanning calorimetry (DSC) and a Td of 356 degrees Celsius. In three separate signal integrity tests, it delivered a 15 percent reduction in Z-axis expansion and demonstrated a 25 percent improvement in dielectric loss over competitive materials. These attributes make it an ideal product for OEMs demanding higher reliability and bandwidth for increasingly difficult designs. In elevated temperature testing, I-Speed demonstrated the ability to withstand 260 degrees Celsius as received (i.e. without conditioning) and after prolonged exposure to high humidity and temperature. Testing was performed on thick, very high layer-count boards with an extremely tight pitch.

I-Tera™ (http://www.isola-group.com/products/i-tera/) is Isola’s next generation, very low-loss material with a Df of 0.0035. I-Tera was designed for multilayer circuit boards including large format, high layer-count backplanes, high-speed digital, hybrid and RF/microwave designs. The electrical properties are lower than competitive products and consistent over temperature. I-Tera has a Tg of 200 degrees Celsius and a Td of 360 degrees Celsius. It offers processing advantages over competitive products in multilayer lamination, extended drill tool life and desmear processes not dependent on the use of plasma. I-Tera will be available globally with standard core constructions and prepregs.

185HR (http://www.isola-group.com/products/185hr/) is Isola’s next generation, high reliability, lead-free compatible, standard loss product. 185HR is an electrically enhanced resin system that meets the OEM’s need for designs with high layer counts, higher bandwidths and where conventional phenolic-cured laminates do not offer the electrical properties required for the desired signal integrity. 185HR has a high glass transition temperature (Tg) greater than 170 degrees Celsius, a decomposition temperature (Td) of 340 degrees Celsius and delivers a reduction in Z-axis expansion and a 30 percent improvement in dielectric loss properties, placing it in the same category as Isola’s conventional High-Tg FR4 family.

Auto-HR (http://www.isola-group.com/products/auto-hr/) is a proprietary, high-performance resin system with a Tg greater than 170 degrees Celsius for multilayer printed wiring board (PWB) applications where maximum thermal performance and reliability are required. It is available in 0.014”, 0.028”, 0.035” and 0.042” thicknesses. Auto-HR will be available to the Asia-Pacific and European markets focused on these constructions to provide superior performance at a competitive cost.

FR406HR (http://www.isola-group.com/products/fr406hr/) is a high-Tg, lead-free assembly compatible FR4 material with the thermal properties of a phenolic-cured resin system. The FR406HR allows for the migration from phenolic-cured and/or standard dicy-cured resin systems that need standard dielectric constants (Dk) and dissipation factors (Df), while maintaining the thermal reliability in the resin system

For more information visit http://www.isola-group.com/products/.

List of Industry Workmanship Standards Commonly Invoked by NASA
The following industry standards are regularly invoked at the NASA project level.

IPC-2221    Generic Standard on Printed Wiring Board Design
IPC-2222    Sectional Standard on Rigid Printed Wiring Board Design
IPC-2223A  Sectional Design Standard for Flexible Printed Boards - Supersedes IPC-D-249
IPC-2225    Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
IPC-6011    Generic Performance Specifications for Printed Boards
IPC-6012A  Qualification and Performance Specification for Rigid Printed Boards
IPC-6013A  Qualification and Performance Specification for Flexible Printed Boards - Amendment 1: 1/2005
IPC-6015    Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures
IPC-6018A  Microwave End Product Board Inspection and Test - HF-318B; Supersedes HF-318A December 1991
J-STD-004  Requirements for Soldering Fluxes - Replaces QQ-S-571: 1994; Amendment 1 - April 1996
J-STD-005  Requirements for Soldering Pastes; Amendment 1 - June 1996
J-STD-006  Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

The following industry standards are under consideration for NASA-wide adoption.

IPC/WHMA-A620AS 
IPC/WHMA-A-620A Space Applications Electronic Hardware Addendum [Cable Harness Standard]

NASA Headquarters Adopts IPC J-STD-001ES. NASA-STD-8739.2 and .3 Cancelled.

After eight years of coordination between NASA and the IPC’s Assembly Joining and Processes Committee on the Space Addendum for the soldering standard J-STD-001 and its accompanying training program, NASA has adopted IPC J-STD-001ES for all Programs and Projects, effective on October 17, 2011. The NASA standards for soldering, NASA-STD-8739.2 and NASA-STD-8739.3, are cancelled as of October 17, 2011.

There are two training courses offered by the IPC for the J-STD-001ES.  Which is the one that should be taken?
Actually NASA will allow three approaches to training:

a.        IPC modular course taught by a certified IPC trainer (CIT, or MIT).  Operators must take Module 1 (global requirements), Module 6 (Space requirements), and a minimum of one other module (2: Wire Prep and Terminals, 3: Through Hole, 4: Surface Mount).  Inspectors must take Module 1, Module 5 (Inspection and Process Control), and Module 6.  All quality classes are taught (Class 1, 2, and 3).  An IPC training certificate is awarded that is portable.

b.      IPC non-modular training taught by a certified CIT or MIT.  All subjects are covered.  Only the requirements for Space are taught (Class 3 + Space). An IPC training certificate is awarded that is portable.

c.       “Home grown” course taught by a certified CIT or MIT.  Home grown courses are subject to review and approval by NASA.  No IPC training certificate is awarded.

Once the student finishes the IPC J-STD-001ES course, are they certified to work on NASA flight hardware?
No.  NASA will require that the supervisor continue to certify the individual for completion of training biennially, competency, frequency of activity (no absence longer than 6 months), and visual acuity.  IPC certification will not be recognized as equivalent to NASA certification though it is a prerequisite.

As a supplier, should I continue to have my operators and inspectors maintain their NASA soldering standard training?
That depends on the type of NASA contracts your company is engaged with now and in the future.  Consult with your NASA customer to determine if there is an opportunity to convert your workforce to the J-STD-001ES during the period of the existing contract and for applicable follow-on contracts for existing systems.  For hardware for new Projects, NASA will require those Projects to flow down J-STD-001ES and not the NASA soldering standards.

Notes on IPC J-STD-001ES
Note 1. Chapter 10 of IPC J-STD-001ES does not apply.
Chapter 10 of IPC J-STD-001ES provides requirements for staking and conformal coating processes.  NASA will continue to apply NASA-STD-8739.1, Polymeric Applications, for these types of requirements and will not use those requirements shown in IPC J-STD-001ES, Chapter 10.

Note 2. Training options for users of J-STD-001ES
Three options are available to operators and inspectors working to the requirements of J-STD-001ES:

a) completion of Module 1, Module 6, and one or more of Modules 2 through 5 of the IPC modular J-STD-001E course.  This course teaches all quality class levels.  The modules are broken up by application/process topics.  Module 6 covers all of the ES requirements.  A portable IPC training certificate is awarded for successful completion of this course, for work in all quality classes.

b) completion of the IPC non-modular J-STD-001ES course.  This course teaches only the ES requirements and all of the application/process topics.  A portable IPC training certificate is awarded for successful completion of this course only for work specified to the ES level.

c) supplier custom course which includes as a minimum, all ES requirements for the applicable application/process topics.  No IPC training certificate is awarded for this training.  Suppliers must make this course available to the NASA customer if that customer chooses to require review and approval.

In all cases, a, b, and c above, the trainer MUST be an IPC certified trainer (either CIT or MIT level).

Note 3. Use of J-STD-001ES on projects or hardware previously held to NASA-STD-8739.2 and .3 requirements:
Projects who baselined NASA-STD-8739.2 and 8739.3 prior to 10/17/11 may opt to accept the use of IPC J-STD-001ES by their suppliers on existing or new hardware without waiver.

These releases are new in January and February 2012 and now available in our online store.

9850A
Surface Mount Placement Equipment Characterization
This document standardizes the parameters, measurement procedures and methodologies used to measure and report pick and place machine accuracy as a relationship to placement speed for a range of SMT component sizes and configurations. This product includes one printed copy of the standard and a CD with support documentation, report forms and the test material drawings in Gerber format. 40 Pages. Released November 2011.

4103A
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits. In addition to updated testing parameters, inspection lot requirements, revised visual acceptance criteria, this revision incorporates a new specification sheet format for new materials that provides both mandatory (e.g., Df and Dk) requirements as well as "loose" requirements (e.g., thermal conductivity and moisture absorption) that can be certified to or called out on fabrication drawings. This new classification format allows for a reduced number of material specification sheets. 56 pages. Released 2011.

J-STD-033C
Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process Sensitive Components
Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC. 18 pages. Released February 2012.

9704A
Printed Circuit Assembly Strain Gage Test Guideline
Strain gage testing allows for objective analysis of the strain and strain rate levels to which a surface mount package may be subjected to during assembly, test and operation. Excessive strain can result in various failure modes for different solder alloys, package types, surface finishes or laminate materials. This document describes specific guidelines for strain gage testing during the printed board manufacturing process, including board assembly, test, system integration and other types of operations that may induce board flexure. This document also provides coverage of test setup and equipment requirements, strain measurement techniques and test report formats. Revision A contains 22 full-color photographs and illustrations depicting instrumented boards and gage placement and has been updated to address lead-free assembly technology. 25 pages. Released February 2012.

HDBK-001E
Handbook and Guide to Supplement J-STD-001
This handbook is a companion reference to J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. It describes materials, methods, and verification criteria that, when applied as recommended or required, will produce quality soldered electrical and electronic assemblies. The intent of the Handbook is to explain the ‘‘how-to,’’ the ‘‘why,’’ and fundamentals for these processes, in addition to implementing control over processes rather than depending on end-item inspection to determine product quality. 100 Pages. Released February 2012.

J-STD-005A
Requirements for Soldering Pastes
This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment (not included with purchase of this standard). Supersedes J-STD-005. 10 pages. Released February 2012.

AJ-820A
Assembly & Joining Handbook
This handbook contains general information and descriptions of proven techniques for assembly and soldering electronic assemblies. Content was developed and reviewed by noted industry experts and experienced committee members. Sections include: handling electronic assemblies, design considerations, PCBs, components, solderability, materials, component mounting, solder techniques and connections, cleaning, conformal coating, encapsulation and potting and rework and repair. 290 Pages. Released February 2012.