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Process Support
7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
7912A End-Item DPMO for Printed Circuit Board Assemblies
9261A In-Process DPMO and Estimated Yield for PCAs
A-311 Process Controls for Phototool Generation and Use
AJ-820A Assembly & Joining Handbook
CM-770E Component Mounting Guidelines for Printed Boards
DPMO-202 IPC 7912A/9261A End Item and In-Process DPMO Set
J-STD-001E Requirements for Soldered Electrical and Electronic Assemblies
J-STD-609A IPC/JEDEC Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes
S-816 SMT Process Guideline & Checklist
TP-1090 The Layman\'s Guide to Qualifying New Fluxes
TP-1114 The Layman\'s Guide to Qualifying a Process to J-STD-001
TP-1115 Selection & Implementation Strategy for A Low-Residue No-Clean Process
WP-009(D)1 A Summary of Tin Whisker Research References
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ETECH-trainingen
Willemselaan 16
PO Box 1005
6460 BA KERKRADE
The Netherlands
Phone: + 31 (0)45 711 23 90
Mobile: + 31 (0)654 23 09 05
info@etech-trainingen.biz
Chamber of Commerce
: 14129416
VAT: NL 1572.23.255.B.01
Rabobank: 1167.31.974
EORI: NL 157223255